High Bandwidth Flash gets first technical specification for AI data centers

A year ago, SanDisk and SK Hynix announced a collaboration to develop a common standard for the High Bandwidth Flash (HBF) ...
Electronic Design

HBM4 and SPHBM4: Scaling Memory Bandwidth for AI and HPC

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
Semiconductor Engineering

Choosing The Right Memory Solution For AI Accelerators

To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models ...
Business Wire

Kioxia Achieves Successful Prototyping of 5TB Large-Capacity and 64GB/s High-Bandwidth Flash Memory Module

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...
Business Wire

JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its ...
Semiconductor Engineering

HBM4 Feeds Generative AI’s Hunger For More Memory Bandwidth

Generative AI (Gen AI), built on the exponential growth of Large Language Models (LLMs) and their kin, is one of today’s biggest drivers of computing technology. Leading-edge LLMs now exceed a ...